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Method of Packing and Containing Pentium 4 Processors for Handling and Shipping

IP.com Disclosure Number: IPCOM000016605D
Publication Date: 2003-Jul-02
Document File: 9 page(s) / 737K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a thermoformed PVC tray and lid for packaging, handling, and shipping Pentium 4 processors for distribution to customers. Benefits include protection of the processor pins.

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Method of Packing and Containing Pentium 4 Processors for Handling and Shipping

Disclosed is a method that uses a thermoformed PVC tray and lid for packaging, handling, and shipping Pentium 4 processors for distribution to customers. Benefits include protection of the processor pins.

Background

Because Intel is the only company shipping Pentium 4 processors, this is a unique concept with no prior state of the art.

General Description

The disclosed method uses a thermoformed PVC tray and lid. Because the pins of the processor are very susceptible to bending, extensive research and development went into creating a cavity/compartment for containment. This cavity/compartment protects the processor from bending during handling, and from shock and vibration in the manufacturing and distribution environment.

The processor sits in the tray (Figures 5, 10), IHS/die face down and pins up, contacting and locating the processor substrate in the four corners only (Figures 5, 7, 11). The lid (Figures 1, 12) applies downward pressure onto the substrate on the centerlines (Figures 1,3, 13) and also providing a “dome” (Figures 4, 15) over the pins, such that there is space between the top of the pins and the top of cavity.�

The action of the tray and lid (Figure 14) provide a cavity where the pins are free floating, but the processor is held rigidly within the cavity/compartment. Because the pins are free floating, they cannot be bent during handling, or damaged by shock and vibration...