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A Flexible Die-Die Interconnect Based on Conductive Polymers for Multi-Die CSPs

IP.com Disclosure Number: IPCOM000016802D
Publication Date: 2003-Jul-16
Document File: 2 page(s) / 40K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a flexible ribbon to connect dies in multi-die CSP packages. The ribbon is a composite of polyimide base material and conductive polymer traces. The ribbon is connected to the bond pads using conductive self-assembled mono layers (SAMs). Benefits include an increase in package assembly throughput.

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A Flexible Die-Die Interconnect Based on Conductive Polymers for Multi-Die CSPs

Disclosed is a method that uses a flexible ribbon to connect dies in multi-die CSP packages. The ribbon is a composite of polyimide base material and conductive polymer traces. The ribbon is connected to the bond pads using conductive self-assembled mono layers (SAMs). Benefits include an increase in package assembly throughput.

Background

Currently, the connections between multiple die in a MC package are accomplished through wire bonding to the substrate and routing through the substrate (see Figure 1).

General Description

The disclosed method is a flexible polymer strip consisting of a polyimide base material (see Figure 2). The base material is coated with a conjugated conductive polymer. This polymer is either lithographically patterned to form the interconnect traces, or the polymer’s electronic state is switched by optical activation. Attachment to the die surface is through a SAM adhesive that forms coordination bonds with the Cu traces on the die surface, and covalent bonds with the conductive polymer traces.� A key point is that the SAM layer must be conductive. Electrical attachment of the connected die can be through either flip chip technology or wire bond technology. Openings are created in the polymer strip such that a combination of wire bond/substrate, and flex polymer tape connections could be made to another die.

Advantages

The following are advantages of the disclosed method...