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Method for an IHS package design using flexible substrates to integrate multiple dice

IP.com Disclosure Number: IPCOM000016804D
Publication Date: 2003-Jul-16
Document File: 4 page(s) / 57K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated heatsink (IHS) package design using flexible substrates to integrate multiple dice. Benefits include improved functionality, improved thermal performance, and improved ease of implementation.

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Method for an IHS package design using flexible substrates to integrate multiple dice

Disclosed is a method for an integrated heatsink (IHS) package design using flexible substrates to integrate multiple dice. Benefits include improved functionality, improved thermal performance, and improved ease of implementation.

Background

        � � � � � The trend of conventional packaging is to combine several Si devices into one package so that the motherboard space can be saved and the cost of package assembly can potentially be reduced. The second die is mounted on the same side of the substrate or mounted underneath the package substrate.

        � � � � � The MCM (same side) approach requires a larger package substrate and is more difficult to assemble. Mounting the second die below the package substrate results in a potential thermal issue. No space is available for mounting a heatsink to the bottom die. The airflow is insufficient between the package substrate and the motherboard to cool the bottom die. Additionally, the package substrate is not a good thermal conductor. The heat generated by the bottom die is not efficiently transferred through the substrate to the heatsink on the top of the package.

        � � � � � Conventionally, a Cu heat spreader is attached to the flip-chip pin grid array (FCPGA) package to enhance heat spreading (see Figure 1). A heatsink is attached on top of the heat spreader with thermal interface material to further dissipate the heat from the package to the ambient environment. This package has only one single die, such as a central processing unit (CPU). For chipset or additional L3 cache, separate packages are required.

Description

        � � � � � The disclosed method is an IHS package design using flexible substrates to integrate multiple dice into the same package. The flip-chip is attached to the FCPGA package body as the conventional FCPGA package (see Figure 2). A slot is open on the Cu heat spreader. One end of the flex substrate can be attached to the flip-chip ball grid array (FCBG...