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Method for the application of an LGA socket with an organic electronic package

IP.com Disclosure Number: IPCOM000016808D
Publication Date: 2003-Jul-16
Document File: 3 page(s) / 191K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the application of a land grid array (LGA) socket with an organic electronic package. Benefits include improved performance.

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Method for the application of an LGA socket with an organic electronic package

Disclosed is a method for the application of a land grid array (LGA) socket with an organic electronic package. Benefits include improved performance.

Background

        � � � � � Conventionally, high-performance socketable electronic packages use either a ceramic electronic package with a land grid array (LGA) socket, or an organic electronic package with pin grid array (PGA) interconnect (see Figure 1). The sustained compressive loading required for electrical interconnect performance is through a retention device (not shown).

General description

        � � � � � The disclosed method utilizes an organic electronic package with LGA socket technology. The key elements of the method include:

•        � � � � Electronic package utilizing an organic substrate and gold plated lands

•        � � � � Land grid array socket

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to improved dielectric properties

•        � � � � Improved cost effectiveness due to the use of an organic package

Detailed description

� � � � � The detailed description pairs microprocessors and LGA socket technology with organic packages to meet increased electrical performance requirements (see Figure 2). The organic packages provide improved dielectric properties relative to ceramic packages. The use of an LGA socket (see Figures 3 and 4) provides a high performance interconnect that enables increas...