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Method for a through-hole mount LGA socket

IP.com Disclosure Number: IPCOM000016809D
Publication Date: 2003-Jul-16
Document File: 3 page(s) / 153K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a through-hole mount (THM) land grid array (LGA) socket. Benefits include improved performance, improved ease of manufacturing, and improved design simplicity.

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Method for a through-hole mount LGA socket

Disclosed is a method for a through-hole mount (THM) land grid array (LGA) socket. Benefits include improved performance, improved ease of manufacturing, and improved design simplicity.

Background

� � � � � A fundamental challenge with electronic packages is to deliver high-performance power delivery and high performance, high pin count I/O through a microprocessor socket with a low component cost. Surface-mounted LGA sockets are a conventional solution (see Figure 1). The LGA socket contains stamped metal contacts retained within a plastic housing. The contacts interface with the printed circuit board (motherboard) and the package through a sustained compressive load between the package and the motherboard. Lands on the package and motherboard are gold plated to prevent oxidation at the electrical interfaces. However, lower component cost and improved ease of manufacturing are required.

        � � � � � Conventionally, these problems have been solved by the use of a surface mount technology (SMT) pin grid array (PGA) socket or a double-compression LGA socket.

General description

� � � � � The disclosed method is an LGA socket utilizing through-hole mount leads for interconnection to a motherboard. The key elements of the method include:

•        � � � � A socket utilizing both a compression interconnect at the socketable interface (LGA) and a THM connection to a printed circuit board

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to lower electrical resistance

• ...