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Method to protect sensitive assemblies or components during shipping, storage, and handling

IP.com Disclosure Number: IPCOM000016810D
Publication Date: 2003-Jul-16
Document File: 5 page(s) / 582K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to protect sensitive assemblies or components during shipping, storage, and handling. Benefits include improved yield and improved ease of manufacturing.

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Method to protect sensitive assemblies or components during shipping, storage, and handling

Disclosed is a method to protect sensitive assemblies or components during shipping, storage, and handling. Benefits include improved yield and improved ease of manufacturing.

Background

        � � � � � Individual devices must be protected from foreign material (FM) from the point of packing to the point of use, including handling, storage, and shipping. The packaging configuration must be easy to handle, count, and pack.

        � � � � � Joint Electronic Devices Engineering Council (JEDEC) style injection molded trays have open tops and bottoms. Thermoformed trays have closed bottoms. Neither type of tray provides FM protection, singulation in a protected mode, or manual removal capability (see Figure 1).

General description

� � � � � The disclosed method provides media that protects sensitive assemblies or components from foreign material from the point of packing to the point of assembly by completely enclosing each independent unit.

        � � � � � The key elements of the method include:

•        � � � � Formed strip that contains a single column of pockets

•        � � � � Finger access zones formed on two sides for ease of component or assembly removal

•        � � � � Perforation for component or assembly protection after singulation until point of use

•        � � � � Adhesive or thermal sealed cover that seals all sides of the pocket for full environmental protection from foreign material

•        � � � � Perforation on the cover to facilitate separation of strip sections while maintaining the protective package

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved yield due to improved protection from foreign material after singulation

•        � � � � Improved ease of manufacturing due to the capability to handle units in groups

•        � � � � Improved ease of manufacturing due to the capability to pack un...