Browse Prior Art Database

Method of Preventing Land Contamination for a Land Grid Array Package

IP.com Disclosure Number: IPCOM000016812D
Publication Date: 2003-Jul-16
Document File: 2 page(s) / 61K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that prevents land contamination of the Land Grid Array (LGA) substrate.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

 

Method of Preventing Land Contamination for a Land Grid Array Package

Disclosed is a method that prevents land contamination of the Land Grid Array (LGA) substrate.

Background

Currently, there is no way to effectively prevent land contamination of the LGA. Figure 1 shows the present state of the art for the bottom side of the LGA substrate. The lands are not shielded from contamination (e.g. foreign material, body oils, sweat, etc.). When the assembled packages are shipped. At OEM sites, the assembly facilities are not at clean room contamination levels. Therefore, the chance of package lands getting contaminated is extremely high.

General Description

In the disclosed method, a contamination prevention medium is added to the bottom of the substrate (see Figure 2). � When shipped, various options can be used. For example, a tape such as Kapton, or a plastic casing or cover over the lands (with a deep cavity in the center to allow for caps) can be used.

Advantages

The following are the advantages of the two options for the disclosed method:

 

  • Advantages of tape: relatively inexpensive, easy to remove, but cannot be reattached.
  • Advantages of cover (.e.g plastic): less expensive than tape, easy to remove, and can be snapped back for reuse.

Fig. 1

Fig. 2

Disclosed anonymously