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Method for integrated heatsinks, processor, and VR

IP.com Disclosure Number: IPCOM000016816D
Publication Date: 2003-Jul-16
Document File: 3 page(s) / 600K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for integrated heatsinks, processor, and voltage regulator (VR). Benefits include improved functionality, improved thermal performance, improved reliability, and improved support for future technology.

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Method for integrated heatsinks, processor, and VR

Disclosed is a method for integrated heatsinks, processor, and voltage regulator (VR). Benefits include improved functionality, improved thermal performance, improved reliability, and improved support for future technology.

Background

        � � � � � Processor performance and VR amperages are increasing while server platform space is decreasing or remains unchanged. Conventionally, the heatsink is typically mounted on the motherboard, and the thermal interface material (TIM) load is applied from the heatsink-side toward the chassis.

General description

        � � � � � The disclosed method is integrated heatsinks, processor, and VR. The disclosed method includes multiple designs. One design is bottom-loaded TIM and a close-fitting VR. Another design has integrated heatsinks.

Advantages

        � � � � � Some implementations of the disclosed structure and method provide one or more of the following advantages:

•        � � � � Improved functionality due to integrating the heatsinks, processor, and VR

•        � � � � Improved functionality due to solving the z-axis component tolerance stack-up

•        � � � � Improved functionality due to isolating the ~100 pound VR connector load

•        � � � � Improved thermal performance due to embedding the heatsinks and retaining the platform cooling airflow direction option

•        � � � � Improved reliability due to subjecting the motherboard to a minimum of bending stress

•        � � � � Improved support for future technology due to maintaining a small form factor

Detailed description

        � � � � � The disclosed method integrates the heatsinks, processor, and VR. The method includes multiple designs.

        � � � � � One design includes bottom TIM-loading and a close-fit VR (see Figure 1). The heatsink is rigidly mounted to the chassis so its dynamic load is not supported by the motherboard under shock and vibration conditions. The heatsink mass is g...