Browse Prior Art Database

IC Package with an Underfilled Heat Spreader

IP.com Disclosure Number: IPCOM000017104D
Publication Date: 2003-Jul-22
Document File: 2 page(s) / 97K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an integrated circuit (IC) package with an underfilled heat spreader. Benefits include improved thermal performance, improved reliability, and improved yield.

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IC Package with an Underfilled Heat Spreader

Disclosed is a method for an integrated circuit (IC) package with an underfilled heat spreader. Benefits include improved thermal performance, improved reliability, and improved yield.

Background

Thermal interface materials (TIMs) used to transfer heat from the IC package die to an integrated heat spreader typically have reliability issues that impact their end of life thermal performance.  Thermal resistance targets must be reduced to allow for this degradation during stress.

Integrated heat spreaders (IHSs) typically have a bleedhole to enable pressure equalization during temperature exposure. This bleedhole can be used to underfill the heat spreader if a gap is left in the sealant adhesive to enable air to escape during resin filling (see Figure 1).

General description

The disclosed method underfills the heat spreader with epoxy resin to improve the reliability of the TIM between the die and heat spreader of an IC package. The epoxy resin adds mechanical strength to the IC package in addition to reducing the moisture absorption rate and the stress/strain induced from temperature cycling.

The key elements of the method include:

•             IC package with heat spreader and thermal interface material

•             An adhesive such as epoxy filled between the heat spreader and the IC package substrate

Advantages

The disclosed method provides several advantages, including:

•             Improved thermal performance due to improved temp...