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Method for an epoxy strip to avoid bonding-wire sweep

IP.com Disclosure Number: IPCOM000017106D
Publication Date: 2003-Jul-22
Document File: 3 page(s) / 35K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an epoxy strip to avoid bonding wire-sweep. Benefits include improved yield.

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Method for an epoxy strip to avoid bonding-wire sweep

Disclosed is a method for an epoxy strip to avoid bonding wire-sweep. Benefits include improved yield.

Background

        � � � � � Bonding-wire sweep has been observed in package assembly. It is caused by the molding compound flow. When the bond pitch is small or the bonding wire is very long, the mold compound flow can cause bonding-wire sweep. The bonding wires can touch each other, resulting in electrical shortage. The conventional solution is to reduce the bonding-wire length and increase the bonding-wire pitch to prevent the bonding wires from touching each other and shorting out (see Figure 1).

Description

        � � � � � The disclosed method dispenses a dielectric epoxy strip to fix the bonding wire location after bonding wires are bonded. When the molding compound is injected into the mold, the bonding wires are not swept by the molding flow. The wires do not touch each other to cause electrical shortage.

        � � � � � Dispensing a dielectric epoxy strip after the wire bonding process makes the mold compound material selection and mold process development easier. Various ranges of mold compound viscosity and mold flow rates can be accepted without causing electrical shortage between the bonding wires.

        � � � � � Dispensing epoxy does not cause bonding wire sweep.

        � � � � � The key elements of the method include:

•        � � � � Dielectric epoxy

•        � � � � Molding compound

        � � � � � The disclosed method can be implemented using the fol...