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Method for a polytetrafluoroethylene/dielectric coating to prevent electrical shortage between bonding wires

IP.com Disclosure Number: IPCOM000017108D
Publication Date: 2003-Jul-22
Document File: 2 page(s) / 31K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a polytetrafluoroethylene/dielectric coating to prevent electrical shortage between bonding wires. Benefits include improved yield.

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Method for a polytetrafluoroethylene/dielectric coating to prevent electrical shortage between bonding wires

Disclosed is a method for a polytetrafluoroethylene/dielectric coating to prevent electrical shortage between bonding wires. Benefits include improved yield.

Background

        � � � � � Bonding-wire sweep has been observed in package assembly. It is caused by the molding compound flow. When the bond pitch is small or the bonding wire is very long, the mold compound flow can cause bonding-wire sweep. The bonding wires can touch each other, resulting in electrical shortage. The conventional solution is to reduce the bonding-wire length and increase the bonding-wire pitch to prevent the bonding wires from touching each other and shorting out (see Figure 1).

        � � � � � Polytetrafluoroethylene has been widely used as a dielectric material.

Description

        � � � � � The disclosed method is to spray coat bonding wires with polytetrafluoroethylene or dielectric materials after the wire bonding process. When the molding compound is injected into the mold, the longer bonding wires may sweep to touch each other. However, the polytetrafluoroethylene and dielectric coating prevents the electrical shortage.

� � � � � Spray coating the bonding wires with polytetrafluoroethylene or dielectric materials after the wire bonding process makes the mold compound material selection and mold process development easier. Various ranges of mold compound viscosity and mold flow rates can be accepted without...