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Flat laminated cable shielding process

IP.com Disclosure Number: IPCOM000017130D
Original Publication Date: 1999-Oct-01
Included in the Prior Art Database: 2003-Jul-22
Document File: 2 page(s) / 14K

Publishing Venue

Siemens

Related People

Roel Hellemans: AUTHOR [+2]

Abstract

I- INTRODUCTION The manufacturing of the Flat Laminated Cable (FLC) is already known. At present, shielded FLC are used in short length and a usual shielding process is to paint or spray the FLC with silver conductive ink, this process is waste consuming. However, automotive applications usually require ten meters FLC length. A cost and waste saving process for FLC high-volume is to use a silver ink bath where all the length of the FLC is dipped. Grounding to the outside conductor of the FLC generally requires a pre-punching of the insulation tape before laminate both tapes (the upper and bottom one). An individual grounding of the shielded FLC is also manufactured. A cost saving process for FLC high-volume is to use a punch machine for entire FLC before the shielding operation during the harness-manufacturing step.

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Verkehr

Flat laminated cable shielding process

Idee: Roel Hellemans, Toulouse; Sylvain Leveille, Toulouse

I- INTRODUCTIONThe manufacturing of the Flat Laminated Cable (FLC) is already known. At present, shieldedFLC are used in short length and a usual shielding process is to paint or spray the FLC with silverconductive ink, this process is waste consuming. However, automotive applications usuallyrequire ten meters FLC length.  A cost and waste saving process for FLC high-volume is to use asilver ink bath where all the length of the FLC is dipped.Grounding to the outside conductor of the FLC generally requires a pre-punching of the insulationtape before laminate both tapes (the upper and bottom one). An individual grounding of theshielded FLC is also manufactured.  A cost saving process for FLC high-volume is to use apunch machine for entire FLC before the shielding operation during the harness-manufacturingstep.

II-GROUNDING PROCESSGrounding consists in making holes through the polyester layer to have an electrical contactbetween the copper track and the screen. Those holes can be done by laser beam or bypunching. The shape, the pitch between the holes and their order can easily be defined.ADVANTAGES:It is possible to manage FLC grounding according to needs.This process isn’t waste consuming.

III- SHIELDING PROCESSThe conductive ink has to be fluid and homogeneous enough to have a regular coat of the FLC.The support takes the FLC piece and dips it in the ink bath....