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Method for a chuck coating for thermal processes

IP.com Disclosure Number: IPCOM000017140D
Publication Date: 2003-Jul-22
Document File: 1 page(s) / 30K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a chuck coating for thermal processes. Benefits include improved performance.

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Method for a chuck coating for thermal processes

Disclosed is a method for a chuck coating for thermal processes. Benefits include improved performance.

Background

        � � � � � Typical silicon wafer processing requires wafers to contact a wafer chuck which can be a smooth surface.� During wafer processing which may involve liquids, gases or heat, residues may be left behind that can accumulate with extended use.� This can ultimately result in wafer adhesion to the wafer chuck that risks wafer breakage and loss of product. Conventionally, this problem is solved by cleaning the tool with isopropyl alcohol and other cleaners.

Wafer chucks are typically made out of aluminum or other metals.

Description

        � � � � � The disclosed method is a nonstick coating on a wafer chuck to prevent wafer sticking. The key elements of the method include:

•        � � � � A nonstick coating process to coat the wafer handling components (wafer chuck and wafer contact points in the process tool)

•        � � � � � Temperature cycling that is performed in a moderate environment not hot enough to degrade the nonstick coating (~500ºC).

        � � � � � The coating of the tooling parts is similar to the coating in cooking pans.

Advantages

        � � � � � The disclosed method provides advantages, including:

•        � � � � Improved performance due to preventing the sticking of wafers in the tool

•        � � � � Improved performance due to improved chemical resistivity

•        � � � � Improved performance due to improved cleaning of the tool...