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Ceramic Parts Manufacture Using Stoichometric Flame Deposition

IP.com Disclosure Number: IPCOM000018591D
Publication Date: 2003-Jul-25
Document File: 2 page(s) / 80K

Publishing Venue

The IP.com Prior Art Database

Abstract

A low cost technique for forming refractory materials by "spray-painting" is described. Four control feeds are employed to vary the Stoichometric of the resulting coating.

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Ceramic Parts Manufacture Using Stoichometric Flame Deposition

        � � � � � � � � � � � � � � � © 2003 Lockheed Martin Corporation.� All Rights Reserved.�

A manufacturing process is disclosed that extends and improves techniques for flame deposition of ceramic materials.� The technique uses stoichometric mixtures of powdered metals and oxidizers to form a flame. � Additional carrier gas, heat sources and fuel/oxidizer mixes are avoided or drastically reduced. � The resulting combustion products are then directly deposited on the surface of the object to be manufactured.

Refractory materials are needed for high temperature applications, but are typically brittle and difficult to machine.� Sintering and related approaches have been used to mold refractory materials, but these approaches typically require high temperature, high pressure molding equipment and molds.� Thus the existing techniques lack flexibility and require expensive equipment to implement.

Refractory materials (other than some metals such as tungsten) are typically oxides, nitrides or borides of selected metals or semi-metals.� When powdered metals (the ones that form refractory materials) are reacted with oxygen, nitrogen or boron the heat of reaction is extremely high.� In fact, very high temperature flames and torches have been developed using powdered metals as the fuel and oxygen as the oxidizing agent.�

By using stoichometric mixtures of powdered metals and oxidizers to feed a flame purity and composition of the resulting ceramic can be better controlled.� Carrier gas, undesirable combustion products, other contaminates and voids are reduced or eliminated.� Vacuum deposition also becomes possible, with additional potential for void reduction.� � An additional benefit is the reduction...