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Method for a MEMS evaporator for liquid or refrigeration cooling of Computing products

IP.com Disclosure Number: IPCOM000018668D
Publication Date: 2003-Jul-30
Document File: 6 page(s) / 115K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a micro electro-mechanical systems (MEMS) evaporator for liquid or refrigeration cooling of computing products. Benefits include improved functionality, improved performance, and improved ease of implementation.

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Method for a MEMS evaporator for liquid or refrigeration cooling of Computing products

Disclosed is a method for a micro electro-mechanical systems (MEMS) evaporator for liquid or refrigeration cooling of computing products. Benefits include improved functionality, improved performance, and improved ease of implementation.

Background

              A process for manufacturing and integrating a silicon evaporator into a computing platform to be used with liquid (single-phase or two-phase) or refrigeration cooling is required. No conventional solution exists for integrating MEMS cooling into a computing platform. All cooling is performed using fans and heatsinks (see Figure 1).

              A major issue with liquid or refrigeration cooling is the manufacturing and integration of the evaporator so it can be easily connected to pumps and condensers. The evaporator must be coefficient of thermal expansion (CTE) compliant with the processor to minimize the stress and warpage between the two components.

              Another major issue is the requirement for a standard manufacturing process that is inexpensive that provides easy integration of the evaporator with current MEMS pumping technology. The integration must include hermetically sealing the system to ensure against leakage.

General description

              The disclosed method is a MEMS evaporator for liquid or refrigeration cooling in a computing  computer. The technique utilizes standard fabrication processing steps to build the silicon evaporator and attach copper tubing to a silicon evaporator.

 

              The key elements of the method include:

•             Hermetically sealed system by using annealed bonding of silicon

•             Evaporator constructed completely of silicon that includes a heatsink, header, and cover

•             Stack-up that provides a symmetric CTE condition between the silicon and evaporator

•             Processor-evaporator warpage minimized by optimizing the heat exchanger design and manufacturing an evaporator base that minimizes the vertical and spreading thermal resistance  while maximizing the base-plate thickness for maximum stiffness and minimum warpage

•             Utilizing silicon mask, etch, copper sputtering and boron doping processes to manufacture an inexpensive evaporator

•             Manufacturing costs reduced by using silicon micro-machining and wafer bonding techniques

•             MEMS evaporator fabricated from other high conductivity materials, such as copper, using standard micro-machining techniques if appropriate

Advantages

              The disclosed method provides advantages, including:

•             Improved functionality due to enabling a construction and integration process for manufacturing a hermetically sealed silicon evaporator using wafer bonding technology and conventional fabrication processes for constructing each component comprising the evaporator

•             Improved performance due to reducing the stresses resulting from CTE mismatch between the...