Browse Prior Art Database

Independent Thermoform Processor Cavity

IP.com Disclosure Number: IPCOM000018757D
Publication Date: 2003-Aug-06
Document File: 4 page(s) / 685K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a processor packaging solution that uses a three-piece thermoform comprised of a tray, lid, and processor cavity cover. Benefits include greater process flexibility and product protection with the independent packaging of the heat sink and processor.

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Independent Thermoform Processor Cavity

Disclosed is a method for a processor packaging solution that uses a three-piece thermoform comprised of a tray, lid, and processor cavity cover. Benefits include greater process flexibility and product protection with the independent packaging of the heat sink and processor.

Background

Currently, the product is shipped out with a thermal solution (i.e. heat sink) and a processor in a 2-piece thermoform design, packaged individually for shipment to customers.

General Description

The disclosed method uses a three-piece thermoform for containment, handling, and shipment of Intel processors (see Figures 1 and 2). The three-piece design enables the independent packaging of the heat sink and processor, allowing each to be packed at a separate time or location.  The following is an example of a possible process flow:

1.      The heat sink is loaded into the thermoform (Figure 3), and lid assembled at manufacturing site A.

2.      The thermoform is shipped to manufacturing site B in bulk.

3.      The processor is loaded into an independent cavity.  (Figure 4)

4.      The third thermoform piece (i.e. processor cavity cover) is added and heat-welded (Figure 5).

5.      The cover is replaced and heat welded (Figure 6).

The package design also allows independent unpacking by the customer, allowing the customer  to store processors separately from heat sinks, thereby maintaining product protection.

Advantages

The following are advantages of the disclosed method:

§         Great...