Browse Prior Art Database

Independent Thermoform Processor Cavity

IP.com Disclosure Number: IPCOM000018757D
Publication Date: 2003-Aug-06
Document File: 4 page(s) / 838K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a processor packaging solution that uses a three-piece thermoform comprised of a tray, lid, and processor cavity cover. Benefits include greater process flexibility and product protection with the independent packaging of the heat sink and processor.

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Independent Thermoform Processor Cavity

Disclosed is a method for a processor packaging solution that uses a three-piece thermoform comprised of a tray, lid, and processor cavity cover. Benefits include greater process flexibility and product protection with the independent packaging of the heat sink and processor.

Background

Currently, the product is shipped out with a thermal solution (i.e. heat sink) and a processor in a 2-piece thermoform design, packaged individually for shipment to customers.

General Description

The disclosed method uses a three-piece thermoform for containment, handling, and shipment of Intel processors (see Figures 1 and 2). The three-piece design enables the independent packaging of the heat sink and processor, allowing each to be packed at a separate time or location.� The following is an example of a possible process flow:

1.      The heat sink is loaded into the thermoform (Figure 3), and lid assembled at manufacturing site A.

2.      The thermoform is shipped to manufacturing site B in bulk.

3.      The processor is loaded into an independent cavity.� (Figure 4)

4.      The third thermoform piece (i.e. processor cavity cover) is added and heat-welded (Figure 5).

5.      The cover is replaced and heat welded (Figure 6).

The package design also allows independent unpacking by the customer, allowing the customer � to store processors separately from heat sinks, thereby maintaining product protection.

Advantages

The following are advantages of the disclosed method:

§         Great...