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A Cost Optimized Thermal Solution for Processors

IP.com Disclosure Number: IPCOM000018758D
Publication Date: 2003-Aug-06
Document File: 3 page(s) / 862K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that optimizes the copper core of an aluminum fin heat sink for thermal mass and temperature distribution. Benefits include improved reliability and reduced process costs.

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A Cost Optimized Thermal Solution for Processors

Disclosed is a method that optimizes the copper core of an aluminum fin heat sink for thermal mass and temperature distribution. Benefits include improved reliability and reduced process costs.

Background

The current state of the art thermal solution is a copper core, aluminum, radial-finned heat sink (see Figure 1). The device weighs 300g and is attach to the processor by a mechanical clip. Fifty percent of the weight of the heat sink is in the copper core. This current configuration is so massive that it can cause solder joint damage during shock and vibration.

General Description

Upon examination, the copper slug has been found to be thermally inefficient (see Figure 2). The disclosed method reduces the weight of the heat sink by removing a right conical section of the copper core. This reduces the weight without effecting the overall temperature distribution or thermal behavior of the heat sink. Figures 3,4, and 5 show the disclosed method verified by modeling it using a thermal finite element computer code.

Advantages

The disclosed method reduces the weight of the heat sink without effecting the overall temperature distribution or thermal behavior; it also improves reliability and reduces process costs.

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Disclosed anonymously