Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Conductive Silicone Interconnect Material as an Alternative to Solder, Conductive Epoxy, or Other Polymer Interconnect Materials

IP.com Disclosure Number: IPCOM000018911D
Publication Date: 2003-Aug-20
Document File: 2 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a silicone with conductive properties. Benefits include a reduction in Highly Accelerated Stress Test (HAST) and resistivity issues.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 83% of the total text.

Conductive Silicone Interconnect Material as an Alternative to Solder, Conductive Epoxy, or Other Polymer Interconnect Materials

Disclosed is a method that uses a silicone with conductive properties. Benefits include a reduction in Highly Accelerated Stress Test (HAST) and resistivity issues.

Background

The current state of the art uses an electrically-conductive epoxy interconnect material, such as a silver-filled epoxy; however, the moisture sensitivity of this epoxy reduces its material properties and resistance values over time. Currently, the problem is solved by using these materials in non-HAST critical areas or in short life span products not requiring a reliable long life. Figure 1 shows an image of a conductive adhesive stenciled onto a bond pad.

General Description

The disclosed method uses an electrically-conductive silicone interconnect material to address the issues of HAST and resistivity that silver-filled epoxies encounter over time. This type of interconnect joint should be much more resistant to stress testing in general. The material, though not yet invented and tested, could function in the same manner as an epoxy. Silver flakes can be mixed with a silicone material, as the flakes are currently mixed with epoxies today. It is expected that the fill weight of the silver in the silicone would be equivalent in levels to that of epoxies. No figure exists of a silicone that has conductive filled material, but it would look similar to the image shown in Figure...