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Method for a fusible solder-coated spherical electrical interconnect standoff

IP.com Disclosure Number: IPCOM000019056D
Publication Date: 2003-Aug-27
Document File: 3 page(s) / 64K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a fusible solder-coated spherical electrical interconnect standoff. Benefits include improved process simplification.

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Method for a fusible solder-coated spherical electrical interconnect standoff

Disclosed is a method for a fusible solder-coated spherical electrical interconnect standoff. Benefits include improved process simplification.

Background

         A requirement exists for a one-step process that provides a controlled, predetermined physical separation between two electrically conducting surface pads while forming an electrical connection between the two electrically conducting surfaces.

         Conventionally, the problem described above is solved by separate process steps for placing a physical stand-off structure between the two surfaces followed by screen-printing a fusible solder material or alloy onto electrical pads to be connected and fusing the solder fusible material to form the electrical connection.

         Atomization is the formation of a material into spheres or balls. It can be accomplished using commercially available means, such as plasma spraying. If the atomization cannot be performed in a reducing atmosphere, it can be done in a neutral atmosphere, such as nitrogen. The balls can subsequently be made into precise spheres while being refused or melted under a reducing atmosphere, such as hydrogen.

General description

         The disclosed method is a fusible solder-coated spherical electrical interconnect standoff.

A solderable material is electroplated onto correctly sized, electrically conducting spheres that have been formed and graded to size. The solderable material-coated spheres (balls) form an electrical connection between two electrical-circuit surface pads. The solderable material provides a soldered electrical connection. The sized, electrically conducting sphere forms a physical stand-off for precise separation between the electrical circuit surfaces that have been electrically joined. One of the preferred materials for the electrically conducting spheres is copper. The entire process of creating the electrical connection and physical standoff occurs in one operation

         The key elements of the method include:

•         Formation of electrically conducting spherical balls

•         Physically grading the electrical...