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Method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging

IP.com Disclosure Number: IPCOM000019057D
Publication Date: 2003-Aug-27
Document File: 2 page(s) / 38K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.

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Method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging

Disclosed is a method for polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. Benefits include improved design flexibility.

Background

         The electrical shorting of wire is exacerbated by a long bond length on stacked-die packages.

This problem is conventionally solved by the use of short wire bonds, which are typically less than 4 mm in length on flash packages. Higher stacked packages have the capability of surpassing the 4-mm length. The problem could be addressed by changing the mold material and/or mold process or by using wire with a thicker diameter.

Description

The disclosed method is the polymeric encapsulation of wire bonding to reduce wire sweep and shorting in stacked-die chip-scale packaging. A polymeric encapsulating material is dispensed over the wire bond prior to mold encapsulation in a stacked die configuration so that the total height of the package is not affected. A creative dispense pattern permits the same loop height clearance of reverse bonds in die-to-die stacking.

         Wire encapsulant affixes wires during the molding of a molded matrix array package (see Figure 1).

         Wire encapsulant covers multiple levels of wire and affixes exceptionally long top die-wire bonds into a matrix prior to molding (see Figures 2 and 3).

Advantages

         The disclosed method provides advantages, including:

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