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Method for a hybrid ceramic/organic flip-chip package for improved thermo-mechanical performance and high-density signal routing

IP.com Disclosure Number: IPCOM000019060D
Publication Date: 2003-Aug-27
Document File: 2 page(s) / 68K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a hybrid ceramic/organic flip-chip (FC) package for improved thermo-mechanical performance and high-density signal routing. Benefits include improved performance.

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Method for a hybrid ceramic/organic flip-chip package for improved thermo-mechanical performance and high-density signal routing

Disclosed is a method for a hybrid ceramic/organic flip-chip (FC) package for improved thermo-mechanical performance and high-density signal routing. Benefits include improved performance.

Background

         Conventional and future silicon designs will require brittle dielectric materials, which require better coefficient of thermal expansion (CTE) matching between the FC package and the die. Conventional ceramic technology does not afford the high-density input/output (I/O) routing that organic build-up packaging can provide.

Description

         The disclosed method is a hybrid ceramic and organic FC package enabling CTE matching between the silicon and the package and high-density organic I/O routing (see Figures 1, 2,
and 3). The ceramic package is used at the die interface, and the organic package is used for key primary routing.

         The key elements of the method include:

•         Ceramic FC core area for power delivery and silicon interconnection

•         Organic package for I/O and second-level interconnection

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to using the improved power delivery and mechanical advantages because of ceramic flip-chip packages

•         Improved performance due to using the improved I/O routing density advantage of organic packaging

•         Improved cost effectiveness due to a lower overall cost compared to...