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Method for die size growth/die-side component placement through an LGA package IHS

IP.com Disclosure Number: IPCOM000019064D
Publication Date: 2003-Aug-27
Document File: 3 page(s) / 77K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for die size growth/die-side component placement through a land-grid array (LGA) package integrated heat spreader (IHS). Benefits include improved performance, improved process flexibility, and improved ease of implementation.

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Method for die size growth/die-side component placement through an LGA package IHS

Disclosed is a method for die size growth/die-side component placement through a land-grid array (LGA) package integrated heat spreader (IHS). Benefits include improved performance, improved process flexibility, and improved ease of implementation.

Background

         Requirements exist for enabling an LGA socket engagement and increasing printed circuit board (PCB) surface area for die size growth and placing die-side components.

         These requirements are conventionally met by a stepped IHS for LGA socket engagement with four support legs. The area for die size growth and die side component placement is limited. Typically, IHS designs are created using a stamping operation. The LGA socket is enabled through the use of a direct socket loading mechanism. Two legs of the IHS are used to put the package lands under load and in contact with the socket terminals (see Figure 1).

General description

         The disclosed method enables an LGA socket and increases the PCB surface are for die growth and die-side component placement utilizing a package IHS.

         The key elements of the method include:

•         LGA package

•         2-Sided stepped IHS

•         LGA socket

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to the use of two legged IHS for the LGA package

•         Improved process flexibility due to enabling additional manufacturing options, including but not limited to stamping and extrusion,...