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Surface Mounting a Socket to a Printed Circuit Board

IP.com Disclosure Number: IPCOM000019067D
Publication Date: 2003-Aug-27
Document File: 2 page(s) / 236K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a helical coil as a pin to connect a high-density interconnect (HCD) socket to a printed circuit board (PCB). Benefits include a more reliable connection between the components.

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Surface Mounting a Socket to a Printed Circuit Board

Disclosed is a method that uses a helical coil as a pin to connect a high-density interconnect (HCD) socket to a printed circuit board (PCB). Benefits include a more reliable connection between the components.

Background

Currently, the HCD socket is comprised of a helical coil suspended in a polymer, which acts as a dielectric between pins (see Figure 1). The pins are pushed from the board through the socket to an electronic device. The electronic package is in contact with the exposed HCD coils, and similarly, the HCD coils on the bottom are exposed to a pad on the PCB. Pressure is applied to the electronic package and the PCB, and allows the two to maintain contact with the coil. However, this constant pressure causes excessive localized flexure.

General Description

The disclosed method uses a coil with only one end exposed (see Figure 2). The exposed end of the coil is wetted with either a solder or dripping process (see Figure 3).The individual HCD coils are added to the socket, then the socket is added to the PCB through a standard reflow process. The device is then ready for mounting the electronic package to the HCD coil.

Advantages

An advantage of the disclosed method is that the coil is soldered to the PCB. This means that contact is more reliable than the current state of the art. Since the coil and polymer comprise a compliant system, the socket itself becomes more reliable.

Fig. 1

Fig. 2

Fig. 3

Disclosed anonym...