Browse Prior Art Database

Method of Increasing Integrated Circuit Surface Area for Implantable Neurostimulator

IP.com Disclosure Number: IPCOM000019284D
Publication Date: 2003-Sep-09
Document File: 2 page(s) / 56K

Publishing Venue

The IP.com Prior Art Database

Abstract

A method of increasing the integrated circuit surface area for an implantable microstimulator includes printing, or manufacturing, the integrated circuitry of a cylindrically-shaped implantable microstimulator on the exterior surface of the cylindrical microstimulator itself, rather than on a planar circuit board located within the housing of the microstimulator.

This text was extracted from a Microsoft Word document.
This is the abbreviated version, containing approximately 53% of the total text.

Method of Increasing Integrated Circuit Surface Area

for Implantable Neurostimulator

Background & Summary

This invention relates to implantable neural microstimulators, Spinal Cord Stimulation, and Deep Brain Stimulation.

In order to be as non-invasive as possible, neurostimulators that are implanted into the human body must be designed to be as small as possible without sacrificing the functionality or safety of the device.

United States Patent Numbers 6,415,184 and 6,509,645 disclose implantable neurostimulators and spherical semiconductors that attempt to decrease the size of an implantable microstimulator by printing, or manufacturing, the integrated circuitry on the surface of the implants themselves, rather than on a circuit board located within the implant. However, these references do not necessarily teach printing the integrated circuitry on the surface of implants of various other shapes, such as a cylinder.

Therefore, a need exists for an invention that prints, or manufactures, the integrated circuitry of a cylindrical microstimulator on the surface of the cylindrical microstimulator.

Description of Invention

This invention addresses the above and other needs by printing, or manufacturing, the integrated circuitry of a cylindrically-shaped implantable microstimulator on the exterior surface of the cylindrical microstimulator itself. Current techniques for manufacturing most microstimulators include placing electronic circuitry on a planar circuit board within the microstimulators. The maximal size of the circuitry is equal to a lengthwise cross section of the microstimulator.

For example, in a spherical implantable microstimulator, a planar circuit board could only be as large as...