Browse Prior Art Database

Method for the PVD of metallic TIM directly onto wafers

IP.com Disclosure Number: IPCOM000019315D
Publication Date: 2003-Sep-10
Document File: 3 page(s) / 67K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the physical vapor deposition (PVD) of metallic thermal interface material (TIM) directly onto wafers. Benefits include improved performance, improved process simplification, and improved cost effectiveness.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 57% of the total text.

Method for the PVD of metallic TIM directly onto wafers

Disclosed is a method for the physical vapor deposition (PVD) of metallic thermal interface material (TIM) directly onto wafers. Benefits include improved performance, improved process simplification, and improved cost effectiveness.

Background

An assembly process is required for applying metallic TIM on individual microprocessor dice. The conventional solution is to procure an individual metallic TIM preform and apply it using standard electronic assembly processing techniques.

The PVD of a wide range of metals onto silicon wafers for applications, such as CD/DVD discs, mirrors, window coatings, is a highly standardized process. It is a highly capable, high-volume manufacturing process. Target materials include the typical metals used for metallic TIM.

         Conventionally, the singulated TIM preform is placed on top of the singulated microprocessor die. The TIM preforms are sized to fit exactly on the die surface. The microprocessor die and TIM are then heated above a critical temperature to wet the singulated TIM onto the die, creating the finished product, which is a metallic TIM covered microprocessor die (see Figure 1).

         The typical silicon wafer has numerous functional microprocessors on it but without any thermal interface material (TIM).

General description

The disclosed method uses the PVD process and equipment to deposit a metallic TIM onto microprocessor dice at the wafer level.

         The key elements of the method include:

•         Silicon wafer

•         PVD equipme...