Browse Prior Art Database

Method for sample preparation using an auto-bonding machine in electrical FI/FA for flash devices after unpackaging

IP.com Disclosure Number: IPCOM000019316D
Publication Date: 2003-Sep-10
Document File: 2 page(s) / 66K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for sample preparation using an auto-bonding machine in electrical failure isolation/failure analysis (FI/FA) for flash devices after unpackaging. Benefits include improved performance and improved yield.

This text was extracted from a Microsoft Word document.
This is the abbreviated version, containing approximately 57% of the total text.

Method for sample preparation using an auto-bonding machine in electrical FI/FA for flash devices after unpackaging

Disclosed is a method for sample preparation using an auto-bonding machine in electrical failure isolation/failure analysis (FI/FA) for flash devices after unpackaging. Benefits include improved performance and improved yield.

Background

                 With the increase of chip-size packages for flash products, rebonding as one of the key sample preparation methods for electrical FI/FA after unpackaging is becoming increasingly difficult. Conventionally, flash devices are rebonded using a manual wedge bonder. However, the successful rate is less than 25%, which must be improved.

         The manual wedge bonder must have all bonds from the die to the package made in a straight line from front to back, using aluminum wire wedge bonding, which makes fairly poor connection. A requirement exists to improve the successful rate and the through-put time (TPT).

General description

         The disclosed method is sample preparation using an auto-bonding machine with golden ball bonding in electrical FI/FA for flash devices after unpackaging. An auto-bonding machine electrically connects a flash device to a ceramic double in-line package (CDIP) for further electrical FI/FA after unpackaging.

         Using the disclosed method, samples have been prepared for further electrical analysis after unpackaging with close to a 100% success rate. Additionally, the TPT is improved.

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to improving TPT

•         Improved yield due to improving the rebonding successful rate

Detailed description

         The disclosed method uses an automatic gold-ball bonder. It can perform bonding from the die to the package in a radius of 360 degrees. The auto gold-ball...