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Method for calibrating the alignment and accuracy of wafer placement in 300-mm FOUPs

IP.com Disclosure Number: IPCOM000019317D
Publication Date: 2003-Sep-10
Document File: 3 page(s) / 131K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for calibrating the alignment and accuracy of wafer placement in 300-mm front-opening unified pods (FOUPs). Benefits include improved functionality.

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Method for calibrating the alignment and accuracy of wafer placement in 300-mm FOUPs

Disclosed is a method for calibrating the alignment and accuracy of wafer placement in 300-mm front-opening unified pods (FOUPs). Benefits include improved functionality.

Background

         The conventional FOUP has a hard plastic shell with horizontal grooves into which the wafers slide (see Figures 1 and 2). Visual access of the inside is poor during operation and pick-and-place arm calibration. This condition leads to difficulty in accurately assessing wafer placement misalignment, which can result in wafer breakage.

         This problem is conventionally solved by an operator looking at the FOUP from the sides to estimate wafer alignment and placement. However, this approach is inadequate, especially in determining if the wafers are bumping into the FOUP wafer slots. Poor alignment and placement has been linked to numerous wafer cracking and breakage issues in the fabrication laboratory.

General description

The disclosed method is calibration for the alignment and accuracy of wafer placement in 300-mm FOUPs. They are modified to enable easy calibration of pick-and-place arms that place wafers into and retrieve wafers from FOUPs on all 300-mm fabrication equipment. A cutout of the outer shell enables easy visual access to the inside of the FOUP and easy verification of robot calibration and wafer placement accuracy.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionalit...