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Ball Feeding Gate and Feed Tube to Resolve Inconsistent Solder Sphere Priming for the Ball Attach Process

IP.com Disclosure Number: IPCOM000019321D
Publication Date: 2003-Sep-10
Document File: 4 page(s) / 252K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that introduces three hardware changes to improve the ball feeding system. Benefits include minimizing solder sphere waste, particularly in the ball placer assembly at the Ball Attach Tool.

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Ball Feeding Gate and Feed Tube to Resolve Inconsistent Solder Sphere Priming for the Ball Attach Process

Disclosed is a method that introduces three hardware changes to improve the ball feeding system. Benefits include minimizing solder sphere waste, particularly in the ball placer assembly at the Ball Attach Tool.

Background

The following are problems associated with the current ball feeding system:

Due to the complexity and sensitivity of the ball attach tool, significant amount of the hazardous waste such as solder ball, were generated as a results of high machine breakdown or wear & tear at Placer Assembly and extensive process control. Current conventional ball feeding system had shown a lot of design weakness induced high solder sphere wastage resulted the ~20-30% wastage from original algo. This incurs higher cost spending on this wastage as well as hazardous chemical disposition such as solder sphere. Average per tool wastage ~32-35 jar /wk was captured at ball bag & surrounding the tool. With invention in placed, total wastage had been reduced significantly to ~4-5jar/wk

  • The existing pneumatic gate is easily worn out at the plastic moving stopper, due to solder spheres being trapped inside during the ball feeding process. A lot of solder sphere will leakage through the worn out stopper. (See figure1)

 

  • The existing ball bin feeder tube collides with the feeder tube, causing frequent misalignments. This results in solder spheres spilling out of the ball bin tube instead of going into the ball bin.
  • The existing ball bin plate contains a larger hole that allows the solder spheres to drop too quickly into the ball bag instead of fill into ball bin. (Figure4)

General Description

The disclosed method introduces the following three hardware changes to address problems with the current state of the art:

 

  • Z curve mechanism (90deg angle) feeder gate. This mechanism eliminates the existing pneumatic gate by replacing it with a z curve...