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Double Layered Front Acting Probe

IP.com Disclosure Number: IPCOM000019323D
Publication Date: 2003-Sep-10
Document File: 4 page(s) / 138K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for the design of a probe that can be used with most types of PCB surfaces, especially the Through Hole Mount (THM) connector hole and connector leads. Benefits include a versatile probe that can handle many different probing needs.

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Double Layered Front Acting Probe

Disclosed is a method for the design of a probe that can be used with most types of PCB surfaces, especially the Through Hole Mount (THM) connector hole and connector leads. Benefits include a versatile probe that can handle many different probing needs.

Background

Current probes on the market are not versatile enough to handle the probing requirements of THM holes, which can be stuffed with connectors or solder capped. Therefore, the wear and tear on normal probes increases, especially when they are used on products with different models and loading requirements on the same test fixture. In order to save costs, the same type of probe for the THM connector area would need to be used to test different models and loading requirements of products under the same product family.

Also, automated test equipment (ATE) using a same in-circuit test (ICT) fixture is not able to test double-sided component loaded boards if all components are not being populated at both sides of the board. This limitation slows down feedback to the front end of the process on the production floor. This is especially true on processes where most of the THM connectors are being populated only after both sides of the SMT placement process are completed.

In today’s HVM environment, keeping an inventory of various probes for different probing requirements can be very expensive, require frequent probe changes, and require resources to maintain the inventory.

General Descript...