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Low Cost and Light Weight Land Grid Array Socket and Retention Mechanism

IP.com Disclosure Number: IPCOM000019324D
Publication Date: 2003-Sep-10
Document File: 2 page(s) / 85K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a retention mechanism frame or a socket body with plastic latches to hold a processor package in place. Benefits include a solution that is light weight and cost effective.

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Low Cost and Light Weight Land Grid Array Socket and Retention Mechanism

Disclosed is a method that uses a retention mechanism frame or a socket body with plastic latches to hold a processor package in place. Benefits include a solution that is light weight and cost effective.

Background

Currently, the state of the art process uses an expensive direct socket loading mechanism, which squeezes the processor between a socket with a stainless steel stiffener and a load plate. This mechanism increases the socket weight and exerts significant stress on the peripheral solder balls, which may cause excessive creep or reliability failures. On mobile applications, the increased weight also requires special surface mount reflow parameters and special fixturing to do inverted reflow.

General Description

The disclosed method uses a retention mechanism plastic frame with plastic latches (see

Figure 1) to hold the land grid array (LGA) package in place. The same is also achieved by providing the latches on the socket body housing (see Figure 2). The latches do not apply any significant load, and their sole purpose is to hold the processor package in place. The retention mechanism reduces local board stiffening, and also improves heat-spreader-to-heat-sink thermal interface material performance.

Advantages

The following are advantages of the disclosed method:

 

  • Lowers the cost by eliminating all the stainless steel components of the current design.
  • Lowers the weight while requiring no change...