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Method for wafer bow and stress measurement on patterned production wafer via pattern recognition using a film thickness tool

IP.com Disclosure Number: IPCOM000019838D
Publication Date: 2003-Oct-01
Document File: 2 page(s) / 54K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for wafer bow and stress measurement via pattern recognition using a film thickness tool. Benefits include improved performance and improved through-put time.

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Method for wafer bow and stress measurement on patterned production wafer via pattern recognition using a film thickness tool

Disclosed is a method for wafer bow and stress measurement via pattern recognition using a film thickness tool. Benefits include improved performance and improved through-put time.

Background

         No conventional film-thickness metrology tool can perform wafer bow and stress measurement on any patterned production wafer via pattern recognition.

General description

         The disclosed method is wafer bow and stress measurement via pattern recognition using a film thickness tool. Wafer bow and stress measurement are performed directly on production wafers. The method monitors wafer bowing/warpage and integrated effects. The disclosed method eliminates the requirement for stress monitoring on test wafers. The method can be employed on any film thickness platform that has a calibrated focus curve and pattern recognition capability.

Advantages

         The disclosed method provides advantages, including:

•         Improved performance due to improved detection of wafer bowing and warpage

•         Improved through-put time due to eliminating the requirement for stress monitoring on test wafers

Detailed description

         The disclosed method can be implemented using the following steps (see Figure 1):

1.         Extract the wafer from the cassette and place it on the measurement stage.

2.         Chuck the wafer to the stage and perform initial pattern recognition to reduce any errors in wafer placement or mea...