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Method to surface mount a heatsink to cool board components

IP.com Disclosure Number: IPCOM000019854D
Publication Date: 2003-Oct-01
Document File: 4 page(s) / 200K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to surface mount a heatsink to cool board components. Benefits include improved functionality and improved performance.

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Method to surface mount a heatsink to cool board components

Disclosed is a method to surface mount a heatsink to cool board components. Benefits include improved functionality and improved performance.

General description

The disclosed method applies surface-mount heatsinks to cool motherboards. The key elements include:

•         Stamped and bent metal component for surface-mount attachment to a motherboard

•         Method for assembling the component to a motherboard

Advantages

         The disclosed method provides advantages, including:
•         Improved functionality due to providing board-level heatsink cooling
•         Improved performance due to lowered temperatures, as indicated during testing

Detailed description

         The disclosed method includes a surface mount technology (SMT) heatsink (see Figure 1). The component is stamped and bent from a suitable metal, such as copper. In the example, three solder tabs are formed at the base with one tab bent the opposite direction of the other two. This tri-pod configuration provides for more stability for the component during assembly. A fourth tab is bent at the top of the component so that a pick-and-place vacuum head can grab the part (out of a tape and reel, for example) and place it onto a motherboard. Holes are punched in the heatsink to provide more surface area for convection and to break-up the boundary layer of the air passing over the heatsink’s surface.

Another possible surface mount heatsink design has a box shape that provides more surface area and stability (see Figure 2). The solder tabs are much the same as in Figure 1, except no third tab is required. A pick-and-place machine nozzle can grab onto the top surface of the heatsink.

         During assembly, solder pads are designed into a motherboard to correspond to the solder tabs of Figure 1. Paste is printed over the pads using standard industry techniques. Later, the heatsink is placed on the solder paste, using typical industry techniques and equipment. Finally, the entire assembly is...