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Method for resin-filled copper-plated via structures for three-layer flexible tape substrates

IP.com Disclosure Number: IPCOM000019855D
Publication Date: 2003-Oct-01
Document File: 2 page(s) / 61K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for resin-filled copper-plated via structures for three-layer flexible tape substrates. Benefits include improved functionality, improved process simplicity, and improved reliability.

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Method for resin-filled copper-plated via structures for three-layer flexible tape substrates

Disclosed is a method for resin-filled copper-plated via structures for three-layer flexible tape substrates. Benefits include improved functionality, improved process simplicity, and improved reliability.

Background

         Three-metal-layer flexible tape is not widely used conventionally. Using prototype samples, copper plated vias are filled by a printed material that is subsequently flattened. This solution adds processing steps to a process that is similar to the one used for CPU substrates (see Figure 1). An improved via-filling solution is required.

         Flexible substrates using three metal layers are being evaluated for use in high speed front-side chip-scale packages (FSCSPs), combining memory and logic processors. The center metal layer is primarily used for a reference plane while layers 1 and 3 are used for routing layers. The third build-up layer is accomplished using a b-stage resin-coated copper foil (RCC).

         Blind via resin filling is conventionally used in the rigid-laminate substrate manufacturing industry.

Description

         The disclosed method is resin-filled copper-plated via interconnect structures for a three- metal-layer flexible substrate. The key elements of the method include:

•         Resin filling of copper plated blind vias in three-metal-layer flexible substrates

•         Resin-coated foil build-up layer during lamination and cure

•         No additional filling/flattening

         During laminat...