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Systems, Methods and Apparatus for Heatsink Grounding/Electromagnetic Compatibility

IP.com Disclosure Number: IPCOM000019890D
Original Publication Date: 2003-Oct-07
Included in the Prior Art Database: 2003-Oct-07
Document File: 3 page(s) / 160K

Publishing Venue

IBM

Abstract

Proper heatsink grounding is becoming a challenging issue as physical dimensions of computer systems and components continue to decrease. This invention reduces the amount of planar board surface area required by introducing a precision heatsink grounding device fashioned not unlike a "pogo pin". The "pogo pin" is a very precise instrument allowing repeatable accuracy for variations in the "Z" dimension. Multiple "pogo pins" are mechanically fastened and positioned around the heatsink base. Traditional heatsink grounding methods require large grounding pads on the planar due to a lack of precision in the grounding mechanism. This invention of using "pogo pins" on a heatsink base allows precise alignment with much smaller than normal grounding pads on a planar.

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  Systems, Methods and Apparatus for Heatsink Grounding/Electromagnetic Compatibility

   A problem solved by this invention is the amount of planar board surface area required for electromagnetic compatibility (EMC)/grounding. Less area for heatsink grounding allows more planar board space for placement of other components which is critical as we reduce the overall size of our computer systems.

     Another important problem solved by this invention is the robustness and accuracy of the invention over current methods. Current heatsink grounding methods utilize a thin, stainless spring steel with protruding tabs or fingers as the ground path. These protruding tabs or fingers are easily damaged in assembly and reposition themselves. This forces planar board designers to leave large grounding pads on the planar board since the tabs/fingers aren't accurately positioned. Our design allows very small grounding pads on the planar board and various height processors and associated stack up tolerances because of the spring loaded feature in our invention. The core idea is to ground a heatsink using height adjustable standoffs or plungers which are spring loaded and can extend or retract based on the processor height. There are several advantages to using these plungers: occupy less planar board area, significantly improved precision over current method in terms of "landing area" accuracy, robustness is greatly enhanced over current heatsink grounding methods, reliability and durabi...