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Method for de-embedding to remove board effects from the return-loss measurements of an active IC package

IP.com Disclosure Number: IPCOM000019987D
Publication Date: 2003-Oct-15
Document File: 5 page(s) / 182K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for de-embedding to remove board effects from the return-loss measurements of an active integrated circuit (IC) package. Benefits include improved functionality and cost saving.

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Method for de-embedding to remove board effects from the return-loss measurements of an active IC package

Disclosed is a method for de-embedding to remove board effects from the return-loss measurements of an active integrated circuit (IC) package. Benefits include improved functionality and cost saving.

Background

         When measuring the return loss of an active package, the package must be mounted and powered up. One of the obstacles is that direct probing at the package pin is not practical unless the connection between the trace and the package pin is physically removed. However, the procedure is destructive to the board. One of the work-arounds is to perform vector network analyzer (VNA) measurements with and without the package on the board. Then, mathematically de-embed the board effects using both measurement data to get the return loss of the active package.

General description

         The disclosed method is de-embedding to remove board effects from the return-loss measurements of an active IC package. The method includes a de-embedding formula that is used with multi-port S-parameter data in a matrix calculation to determine the S-parameter of the package (with silicon).

Advantages

         Some implementations of the disclosed structure and method provide one or more of the following advantages:

•         Improved functionality due to providing a mathematical procedure for de-embedding board effects from the return loss measurement of active silicon

•         Improved functionality and cost saving due to providing a nondestructive measuring procedure

Detailed description

         The disclosed method is de-embedding using measured S-parameter data. Two sets of S-parameters are required (see Figure 1):

•         4-Port measurement of the board without the package

•         2-Port measurement after the package is mounted

         In the mathematical model of the geometry, a and b represent the incident/reflect wave, respectively. The numbers 1, 2, 3, 4 indicate the port number (see Figure 2). The relationships of the measurements can be expressed (see Figures 3 and 4).

         The result is the two-port S-parameter of the active package without the boar...