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Water-filled copper bladder for cooling high-density electonic hardware

IP.com Disclosure Number: IPCOM000020009D
Original Publication Date: 2003-Oct-17
Included in the Prior Art Database: 2003-Oct-17
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Abstract

This invention solves the problem of cooling multiple closely spaced electronic modules, stacked parallel to each other, by inserting water-filled copper bladders that are squeezed between the modules.

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Water-filled copper bladder for cooling high-density electonic hardware

   Cooling of many closely spaced electronic modules, stacked parallel to each other, is a challenge. The high heat density limits the cooling design to water cooling. One known art is to insert deflated, relatively flat, plastic balloon-like, water containing envelopes into the tight space between two modules to be cooled. When water pump is turned on the balloon-like envelope expands pressing against the modules to be cooled. The problem with this present art is that the balloons are made of plastic and are therefore prone to water leakage. A metallic structure that is cost-effective would be desirable.

     The proposed invention bonds copper foils to a fiber glass reinforced epoxy frame. The frame has inlet and outlet nozzles soldered into it. This metallic-membrane cooling hardware, shown below, is cost effective and more reliable than the all plastic structure presently in use. The cooling structure consists of copper foils bonded to a glass reinforced epoxy frame. The copper foils faces bonded to the epoxy have black oxide grown on them for improved adhesion to the epoxy. Bonding to the epoxy is done at elevated temperature and pressure. The figure showns two copper foils on each side of the frame for redundancy. As is already a known art, vacuum can be created between the two foils. Loss of vacuum is indicitive of a leaky structure. The copper foil thickness is nominally 0.005 inch. Under the...