Browse Prior Art Database

Method to create a contact on the edge of a flip-chip IC package

IP.com Disclosure Number: IPCOM000020155D
Publication Date: 2003-Oct-29
Document File: 4 page(s) / 105K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method to create a contact on the edge of a flip-chip integrated circuit (IC) package. Benefits include improved functionality and increased contact without a commensurate increase in substrate size.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 58% of the total text.

Method to create a contact on the edge of a flip-chip IC package

Disclosed is a method to create a contact on the edge of a flip-chip integrated circuit (IC) package. Benefits include improved functionality and increased contact without a commensurate increase in substrate size.

Description

         The disclosed method makes use of a series of plated through-holes (PTH) purposefully placed at the edge of a flip-chip IC package where the package will be sawed away from the fabrication panel. As a result of the saw operation, a connection to an interior signal path is exposed (see Figure 1). This area can then be built up (plated) by follow-on manufacturing processes to create a connection pad. By modifying the associated socket that the device is mated with, an end user configurable or permanent connection to the device can be created.

         Depending on how the associated socket is designed, the contacts can be accessible post–assembly by the end user for adding connections to devices, such as a logic analyzer (see Figure 2). A removable flexible cable with a mounted spring contact is shown. The design can be modified to make the contact a permanent feature of the socket with a corresponding bump on the bottom side of the socket. A series of holes can be molded to create an horizontal access through the vertical edge of the socket at the contact center line. This approach enables the use of a rigid printed circuit board with pogo style pins to be clipped to the side of the socket.

         By no...