Browse Prior Art Database

Method for an FC-MAP IHS

IP.com Disclosure Number: IPCOM000020165D
Publication Date: 2003-Oct-29
Document File: 4 page(s) / 78K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a flip-chip matrix array package (FC-MAP) integrated heat spreader (IHS). Benefits include improved functionality, improved process simplicity, and improved reliability.

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Method for an FC-MAP IHS

Disclosed is a method for a flip-chip matrix array package (FC-MAP) integrated heat spreader (IHS). Benefits include improved functionality, improved process simplicity, and improved reliability.

Background

The small form factors created by matrix array packages require thermal management (heat spreading) solutions.

Some conventional molded package designs incorporate a drop-in heat spreader, which is applied prior to the molding step.

Mold compound cracking and delamination have been observed in the exposed die FCMMAP.

General description

The disclosed method is an IHS that attaches to a FC-MAP. The heat spreader adds stiffness and corner/edge protection to a thin substrate flip-chip matrix array package without requiring over-molding.

         The key elements of the method include:

•         IHS plate in a strip format with dimensions that are aligned to the MAP strip

•         IHS that is fabricated from a suitable material, such as aluminum or copper

•         Preapplied stiffener plate adhesive

•         Bonding to an unmolded matrix array strip (post flip-chip underfill)

•         Excising during the saw singulation process

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to providing a thermal solution for the small form factors created by matrix array packages

•         Improved functionality due to enabling the application of an IHS using a strip assembly process

•         Improved functionality due to providing a platform for small-package handling during test and board mounting

•         Improved process simplicity due to eliminating the requirement for an over-molding step

•         Improved reliability due to avoiding potential interactions between mold compound, die underfill, and silicon

Detailed description

The disclosed method enables the application of an IHS using a strip assembly process, which is an advantage as the package size decrease...