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Local Stiffening Device for Motherboards

IP.com Disclosure Number: IPCOM000020169D
Publication Date: 2003-Oct-29
Document File: 2 page(s) / 174K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a stiffening device that can be placed near a package or component. Benefits include reducing board flexure and maintaining reliability and mechanical integrity.

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Local Stiffening Device for Motherboards

Disclosed is a method that uses a stiffening device that can be placed near a package or component. Benefits include reducing board flexure and maintaining reliability and mechanical integrity.

Background

Currently, board flexure problems are sometimes solved by using a cumbersome, retention mechanism (see Figure 1), coupled with a backing plate on the back side of the board.

General Description

An example of the disclosed method is shown in Figure 2. It consists of a stiffener body made of a rigid material (e.g. metal, plastic, etc) and a method of tightly coupling the stiffener to the board. The stiffener surrounds the desired component and locks onto the motherboard through the use of anchors (e.g. clips or wave solder posts) or adhered to the board by an epoxy. The primary concern is that the stiffener is securely attached to the board so that any flexure of the board will be resisted by the stiffener body itself.

Advantages

The following are advantages of the disclosed method:

 

  • Increases the rigidity of the motherboard in the vicinity of the package with minimal impact to volumetric “keep out” zones.
  • Allows the installation of a heat sink, independent of the stiffener.

Fig. 1

Fig. 2

Disclosed anonymously