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Method for wave solder fan attachment

IP.com Disclosure Number: IPCOM000020172D
Publication Date: 2003-Oct-29
Document File: 4 page(s) / 105K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for wave solder fan attachment. Benefits include improved functionality, improved reliability, improved performance, and improved design flexibility.

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Method for wave solder fan attachment

Disclosed is a method for wave solder fan attachment. Benefits include improved functionality, improved reliability, improved performance, and improved design flexibility.

Background

Conventional fan attachment is not appropriate for applications where limited height dimensions and/or direct contact can adversely affect the component. Direct attachment of the fan causes vibration, which may damage the component or solder joint.

         Conventionally, fans are attached to a heatsink or directly on top of the component using screws or flat clips. The thermal solution rests on the component. Devices surrounding this active heatsink rely on the air flow generated by the heatsink fan.

General description

The disclosed method is the mechanical attachment of a cooling fan or other solution to a printed circuit board (PCB). A single component is comprised of soldered leads at one end and a mechanism for attaching a standard box fan at the other end. This approach decouples the fan from the device package, eliminating the potential effects that vibration and extra mass can have on solder joint reliability.

         The key element of the method includes a one piece mounting pin consisting of an anchoring mechanism (a through hole solder lead), a shank that provides standoff for the fan, and a connecting mechanism that attaches to the fan. This component enables the fan to be elevated above the heat source rather than being placed directly on it.

The disclosed method provides fast/easy fan attachment, removes the vibration from the device being cooled, and enables greater flexibility to replace or upgrade the fan. The use of the disclosed method on a PCI add-in card provides cooling, avoiding the use of large heatsinks.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to enabling the fan to be elevated above the heat source rather than being placed directly on it, providing cooling for nearby devices

•         Improved reliability due to removing a contributor to joint stress by reducing the mass directly supported by component solder joints

•         Improved reliability due to eliminating the vibration induced by direct contact to the component

•         Improved performance due to the capability of accommodating height restrictions because of the placement of the cooling solution on a PCI card

•         Improved performance due to fast/easy fan attachment, replacement, and upgrading

•         Improved design fl...