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Rapid Curing Epoxy Resin Dielectric Film for Substrates Prepared by Hot Embossing

IP.com Disclosure Number: IPCOM000020304D
Publication Date: 2003-Nov-12
Document File: 2 page(s) / 47K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that uses a rapid curing epoxy resin formulation that achieves a high level of cure under typical hot embossing conditions. Benefits include reduced hot embossing time and reduced post-embossing cure time, as well as reduced process costs.

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Rapid Curing Epoxy Resin Dielectric Film for Substrates Prepared by Hot Embossing

Disclosed is a method that uses a rapid curing epoxy resin formulation that achieves a high level of cure under typical hot embossing conditions. Benefits include reduced hot embossing time and reduced post-embossing cure time, as well as reduced process costs.

Background

Current state of the art epoxy dielectric film (see Figure 1) is comprised of latent cure catalysts and less reactive hardening agents, to ensure a less rapid cure and to maximize shelf life and electric properties.

To avoid losing features during post-embossing cure, the film can be partially cured prior to hot embossing; however, this leads to poor images in the film. The imprinted features are not as deep and well defined. The hot embossing process can be extended to provide 5 to 15 minutes at 165oC; however, such long embossing times are not feasible for HVM manufacturing, due to cost and UPH concerns.

General Description

The disclosed method’s epoxy resin is capable of achieving a high level of cure under typical hot embossing conditions (e.g.170oC for one minute). Rapid curing is achieved by:

 

  • using a moderate concentration of a highly active catalyst, such as triphenyl phosphine
  • using highly reactive hardening agents, such as meta-phenylenediamine

The dielectric film is substantially cured after embossing at temperatures of about 100 to 200oC for less than one minute. The epoxy resin attains greater than 75% cure in less th...