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Application of a Wire Bondable Flex Tape BGA Package to High Speed Devices

IP.com Disclosure Number: IPCOM000020306D
Publication Date: 2003-Nov-12
Document File: 2 page(s) / 100K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an extension of an existing flex tape BGA package; the disclosed method uses a cavity-down, two layer stack up on a die-up (i.e. cavity-up) package configuration. Benefits include enhancing thermal performance and eliminating the need for vias for the signal I/O connection.

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Application of a Wire Bondable Flex Tape BGA Package to High Speed Devices

Disclosed is a method for an extension of an existing flex tape BGA package; the disclosed method uses a cavity-down, two layer stack up on a die-up (i.e. cavity-up) package configuration. Benefits include enhancing thermal performance and eliminating the need for vias for the signal I/O connection.

Background

Vias, plating stubs, thick substrate cores, and wire bonds are some of the major package components that can degrade signal transmission inside a package. Removing or replacing some or all of these components could extend a particular packaging technology for high-speed signals.

Currently, vias (especially staggered vias) and thick cores introduce adverse electrical effects, and continue to be major factors contributing to package bandwidth reduction.

General Description

The disclosed method uses a package with a two-layer version of a widely available single-layer flex BGA package. The key features of the two-layer package include:

 

  • Solder balls which are directly attached to the signal layer, eliminating the need for a signal I/O via
  • Increased ball availability, compared to cavity-down packages of the same size
  • Uses a cavity-down stack up on a die-up package configuration; the die-up package has the opening on the ground/power layer for wire bond access to the lower bond pad layer

A cross-sectional diagram of the two-layer flex BGA package is shown in Figure 1.

Advantages

The following are adva...