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Method by which one of a multiple package stack configures another package

IP.com Disclosure Number: IPCOM000020308D
Publication Date: 2003-Nov-12
Document File: 3 page(s) / 41K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method by which one of a multiple package stack configures another package. Benefits include improved functionality.

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Method by which one of a multiple package stack configures another package

Disclosed is a method by which one of a multiple package stack configures another package. Benefits include improved functionality.

Background

         Conventionally, one package is stacked on top of the other with signals connecting the top package to either the bottom package die or the solder ball array of the bottom package. (Other means may be used to connect the bottom package to the system board.) Typically, the interconnect traces of the top and bottom packages determine the die configuration and the way that the die in the two packages are used.

         Conventional solutions require several versions of the bottom and/or top packages. Each version has different combinations of dice contained within the bottom packages. Multiple builds are required with different manufacturing processes. More inventory control logistics are required.

Description

         The disclosed method uses one package to define the configuration of a die contained within another package. Because the first package is attached to the second package, the functionality of the die in the second package can be modified. This approach enables the manufacture and stockpiling of a package with multiple capabilities. When another package is constructed, it can be setup to enable only the features that are contained within the companion package that are required to meet customer requirements.

         A bond wire can be used to configure what the bottom die CE pin is connected to. In this case, two choices are available: CE signal and GND. When the top package is mounted on the bottom package, the position of the selected bond wire determines the configuration and function of the die in the bottom package (see Figure 1).

         The bottom package is able to be prebuilt and stored in inventory. When the top package is assembled, the configuration of the bottom package is determined by one or more sets of bond wires. When the top package is built, several units for each of one or more configurations may be built using only changes to the bond wire diagram. Multiple completed...