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Method for cooling the backside of a desktop motherboard while providing mechanical support

IP.com Disclosure Number: IPCOM000020311D
Publication Date: 2003-Nov-12
Document File: 5 page(s) / 115K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for cooling the backside of a desktop motherboard while providing mechanical support. Benefits include improved functionality and improved performance.

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Method for cooling the backside of a desktop motherboard while providing mechanical support

Disclosed is a method for cooling the backside of a desktop motherboard while providing mechanical support. Benefits include improved functionality and improved performance.

Background

As power increases in the processor, the ohmic self-heating of the printed circuit board (PCB) increases. This increase exceeds 100° C above 130W of power, forcing the PCB to require a thermal solution. The application of a thermal solution to cool the bare PCB is expected to be accompanied by a massive thermal solution for the chipset and the CPU. These two components may exceed 550 grams in weight.

Conventionally, PCBs are not cooled.

General description

The disclosed method places a solder heatsink inside a chassis that conducts heat from the backside of the motherboard. The heatsink acts as a mechanical support as well as a thermal solution for cooling the PCB.

The key elements of the method include:

•         Heatsink

•         Pads

•         Chassis

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to enabling thermal cooling of a PCB that is subject to ohmic-self-heating

•         Improved performance due to transferring heat to the thermal solution through the pads located on the bottom of the PCB

Detailed description

The disclosed method conducts heat into the heatsink and down to the bottom of the thermal solution. Tabs on the bottom of the heatsink are soldered to the PC...