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Method for package-level LEDs

IP.com Disclosure Number: IPCOM000020313D
Publication Date: 2003-Nov-12
Document File: 3 page(s) / 56K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for package-level light-emitting diodes (LEDs). Benefits include improved functionality.

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Method for package-level LEDs

Disclosed is a method for package-level light-emitting diodes (LEDs). Benefits include improved functionality.

Background

Personal computer (PC) manufacturers can design machines with transparent cases. Improving the overall aesthetics of the package presents an opportunity for package designers to distinguish their products.

Conventional PC modifications can include LED designs as part of the case or fan rather than the package (see Figure 1), for example:

A: Fan with LED

B: Computer case with LED/cathode tube

C: Computer case

General description

The disclosed method is integrated LEDs in package designs. The assembly of LED parts may occur as part of package assembly or may be performed post-assembly. The LED function may be integrated into the package performance. The LED can emit a glow from beneath any additional devices placed on or around the package.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to using the LED glow to distinguish product designs within a market

•         Improved functionality due to integrating the LED into the performance of the package

•         Improved functionality due to enabling design customization

Detailed description

         The LED can be designed to share power and ground connections with the die. As performance increases and the CPU draws more current, the LED dims.

Package connections can be designed on the surface of the package for LED attachment with a design of pads for p...