Browse Prior Art Database

Method for a side connection for a stacked package

IP.com Disclosure Number: IPCOM000020314D
Publication Date: 2003-Nov-12
Document File: 3 page(s) / 71K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a side connection for a stacked package. Benefits include improved functionality and improved performance.

This text was extracted from a Microsoft Word document.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 59% of the total text.

Method for a side connection for a stacked package

Disclosed is a method for a side connection for a stacked package. Benefits include improved functionality and improved performance.

Background

A stack of two or more dice can require a complicated series of process steps using flip-chip technology, wire-bonding technology, adhesive for die-to-die stacking, and a molding process, with accurate thickness/alignment. One problem constitutes the failure of the entire package because no rework can be done.

A requirement exists to enable rework on stacked packages.

General description

The disclosed method is a side connection for a stacked package. The package features side connection terminals. A package-to-package signal connection is made by an enclosure socket with an inner-connection terminal. As a result, multiple packages can be stacked easily. Rework is possible if a component fails after electrical testing. Electrical signal transmission performance is improved when compared to a top-to-bottom connection.

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to the ease of performing rework because the stacked package does not use an adhesive connection, such as a solder paste, between the packages’ electrical connection

•         Improved functionality due to the ease of stacking into an enclosure socket

•         Improved performance due to good electrical connection through package side terminals because of minimal signal routing compared...