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Method for a thin-film deposited device on package substrates and PCBs for high accuracy measurements

IP.com Disclosure Number: IPCOM000020316D
Publication Date: 2003-Nov-12
Document File: 3 page(s) / 79K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thin-film deposited device on package substrates and printed circuit boards (PCBs) for high accuracy measurements. Benefits include improved functionality and improved performance.

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Method for a thin-film deposited device on package substrates and PCBs for high accuracy measurements

Disclosed is a method for a thin-film deposited device on package substrates and printed circuit boards (PCBs) for high accuracy measurements. Benefits include improved functionality and improved performance.

Background

Errors can be induced in measurements taken on PCBs and package substrates.

Conventionally, measurements are obtained using external devices that contact the board or package substrate. The use of external devices introduces additional measurement error (see Figure 1).

The alternative method is to use conventional embedded devices. However, they have very low resistances (<10 Ohms), causing poor measurement accuracy.

General description

The disclosed method is a thin-film deposited device on a PCB or package substrate for highly accurate board-level measurements. The method provides the capability to obtain measurements in locations where external devices cannot be used.

         The key elements of the method include:

•         Thin-film deposition manufacturing process to make device

•         Small size and high resistance of device

•         4-wire measurements at board level to measure device

Advantages

         The disclosed method provides advantages, including:

•         Improved functionality due to the capability to obtain measurements in locations where external devices cannot be used

•         Improved performance due to the small size of the embedded structure

•         Improved performance due to the high resistance of the structure...