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Direct Mechanical Attach of a Thermal Solution to a CPU Integrated Heat Spreader

IP.com Disclosure Number: IPCOM000020319D
Publication Date: 2003-Nov-12
Document File: 2 page(s) / 36K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that directly attaches a thermal solution to a CPU's Integrated Heat Spreader (IHS); this method enables an attach force in excess of that allowed by an indirect attach process. Benefits include improved thermal performance.

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Direct Mechanical Attach of a Thermal Solution to a CPU Integrated Heat Spreader

Disclosed is a method that directly attaches a thermal solution to a CPU’s Integrated Heat Spreader (IHS); this method enables an attach force in excess of that allowed by an indirect attach process. Benefits include improved thermal performance.

Background

The current method to attach a heat sink to a processor is through a clip that is directly (or indirectly—through a retention mechanics) tied to the motherboard. The purpose of this clip is to hold the heat sink to the processor, and prevent disengagement during shock and/ or vibration. The force generated by the clip is the resultant surface-to-surface contact of the IHS and the heat sink. These surfaces typically use a grease medium to enhance thermal transfer. The thinner the medium (i.e. BLT), the better the transfer.

The heat sink clip typically saddles the heat sink on opposite ends. Since the footprint of the heat sink is four to six times that of the IHS, the clip is designed to engage with the motherboard, or a retention mechanism designed to attach to the motherboard. As a result, the force that can be applied is dictated by the bending moment, or strength, of the motherboard (see Fig 1). Excessive bending of the motherboard may cause failures within the board.

General Description

The disclosed method increases the force between the IHS and the heat sink by mechanically attaching the two together (see Fig 2). This mechanical att...