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Method for a ceramic fiber-enhanced organic substrate

IP.com Disclosure Number: IPCOM000020323D
Publication Date: 2003-Nov-12
Document File: 2 page(s) / 42K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a ceramic fiber-enhanced organic substrate. Benefits include improved functionality and improved yield.

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Method for a ceramic fiber-enhanced organic substrate

Disclosed is a method for a ceramic fiber-enhanced organic substrate. Benefits include improved functionality and improved yield.

Background

Conventional core materials of organic substrates contain fine glass fibers that can be easily bent under stress. Materials within substrates that are mismatched in terms of their coefficient of thermal expansion (CTE) can warp.

A tightening/supporting jig is used in substrate process (curing) at the panel level to reduce substrate warpage, which is the main contributor of ball coplanarity yield loss. Units with ball coplanarity > 7 mils are typically rejected (~0.1% yield loss).

In general, the Young’s modulus of glass is approximately 1x107. The Young’s modulus of ceramic (aluminum oxide) is approximately 5x107. If the diameter of a fiber is too small, the amount of surface defects become significant and the fiber becomes less rigid. So the diameter of ceramic fibers should be larger than 0.005 inches.

General description

The disclosed method is an organic substrate core material comprised of cross-linked ceramic fibers and resin, which enhances the strength of core layer to prevent substrate warpage.

The ceramic material is much more rigid than glass. The substrate core layer with enhanced ceramic fibers and resin can tolerance the thermal stress created during processing (such as reflow and curing) with less bending. As a result, substrate warpage is reduced.

Advantages

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