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Method for substrate panel coplanarity failure prevention

IP.com Disclosure Number: IPCOM000021031D
Publication Date: 2003-Dec-17
Document File: 2 page(s) / 468K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for substrate panel coplanarity failure prevention. Benefits include improved functionality and improved reliability.

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Method for substrate panel coplanarity failure prevention

Disclosed is a method for substrate panel coplanarity failure prevention. Benefits include improved functionality and improved reliability.

Background

         Coplanarity failure that is related to the substrate panel edge can occur with organic flip-chip ball grid array (FCBGA) packages during the reflow process. Substrate panel mapping data indicates FCBGA package coplanarity failures may originate from the panel edge.

         The substrate reflow process is a main contributor to panel warpage.

         Organic substrate material tends to be more sensitive to warpage when it is subjected to heat treatment process as compared to other substrate materials.

         The conventional solution is a two-sided panel support jig, for use during reflow (see Figure 1). However, this solution is not suitable because of a high rate of edge coplanarity with large substrate panels. A gap can occur between the support jig and the substrate panel. The lack of panel base is insufficient to provide a solid guide to control panel interaction during the reflow heating process.

Description

         The disclosed method is a four-sided panel support jig with a spacer guide and a bottom support plate to prevent substrate panel coplanarity. The structure distributes the stress on the substrate panel during reflow processing that includes heat treatment.

         The disclosed method can be validated by experimentation. Results for leg #4 indicate that substrate panel edge coplanarity meets...